מציאת משרת הייטק בחברות הטובות ביותר מעולם לא הייתה קלה יותר
Intel Direct Lid/Stiffener Attach Packaging Module Development Engineer Malaysia, Kedah 588721874
Today
The position is for Package Module Development Engineer for direct lid/stiffener attach module as part of ATTD (Assembly and Test Technology Development) in Asia initiative. The candidate will define and establish process flow, conduct FMEA assessment, procedures, drawings review and equipment configuration for NPI products. Selects and develops material and equipment (recipe, collaterals based on design rules) and drives improvement for the process to meet quality, reliability, cost, yield, productivity and manufacturability requirements over variables such as material, method, equipment, environment and operating personnel. Plans and conduct experiments to fully characterize the process throughout the development cycle. Develops solutions to problems utilizing formal education, statistical knowledge, and problem-solving tools. Candidate will also participate in pathfinding activities including new TIM (thermal interface material) qualification with regards to thermal performance, new failure mode characterization and resolution.
Qualifications:
Qualifications:
Minimum Qualifications:
- Bachelor’s/Master's degreein a relevant science, engineering, and technology fields (Physics, Mechanical, Chemical, Electrical, Electronic and Materials Engineering related field).
- Min. 2 years in process development and equipment engineering in semiconductor field.
- Involvement in research and development in assembly and packaging.
- Knowledge in statistical design of experiments and problem-solving techniques.
Preferred Qualifications:
- 4 years+ experience preferred in process development and equipment engineering in semiconductor field.
- Experience in lid/IHS (integrated heat spreader), stiffener attach and dispensing process.
- Data science/statistical tools experience (JMP/SQL) and AI/ML knowledge is a plus.
משרות נוספות שיכולות לעניין אותך
