Intel Chip Attach/Ball Attach Packaging Module Development Engineer 

Malaysia, Kedah 

874062541

Job Description:

Packaging Module Development Engineer within Chip Attach Module/SLI Assembly Module (CAM/SLAM) in Assembly Test Technology Development (ATTD) as part of ATTD in Asia initiative.

CAM/SLAM Process covers: Chip Attach, Component Attach and Solder Ball Attach

• Candidate will focus on Process & Technology Development for New Product (NPI), Shuttle Program, Test Vehicle & IFS Product.
• Technical knowledge in Research & Development (R&D), Process Development, Process Engineering, Design of Experiment (DOE), Statistical Process Control (SPC), Failure Modes/Effects Analysis (FMEA), Quality, Yield Improvement, Optimization
• Pathfinding, developing, qualifying, and ramping materials to transfer to high volume manufacturing process in factories.
• Develops process specifications applying principles for design of experiments and data analysis, and documents improvements through white papers.
• Optimizes and improves the efficiency of manufacturing of packages, developing processes to meet quality, reliability, cost, yield, productivity and manufacturability requirements.
• Conducting fundamental studies and performing experiments to characterize materials, process, identify potential failure modes, understand the performance interactions, optimization, assess feasibility of technology use on product, and make technology recommendations.
• Collaborating closely with other cross-functional team to build material technologies on test vehicles and products and assessing their performance.

Qualifications:

• BEng/MSc/PhD degree in relevant engineering disciplines (Mechanical, Materials, Chemical, Electrical);MSc & PhD is preferable.
• Min. 5 years in semiconductor assembly equipment and process; 8 Years experience and above are preferred.
• Excellent influencing, written and verbal communication skills.
• Strong data analysis capabilities and problem-solving skills.
• Proactive and positive approach towards challenges. Able to work under tight timelines and perform under pressure.

Experienced HireShift 1 (Malaysia)Malaysia, Kulim

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.