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What you'll be doing:
Work on crafting creative Signal and Power Integrity solutions to complex system design problems.
System-level power integrity simulations of high-performance AI systems, graphic cards, and Tegra systems.
Work closely with VLSI power teams and package/board design teams to design, optimize, and model power delivery networks (PDN) including dies, packages, boards, and voltage regulators.
Package and board PDN guidelines creation, review, and post layout PI extractions.
Opportunity to work in a dynamic cross-functional role to optimize package, PCB, ASIC, mixed signal circuit.
What we need to see:
MS/PhD in Electrical Engineering or equivalent experience.
8+ years of industry experience.
Strong technical background in applied electromagnetics, transmission line theory, and signal processing is highly valued.
Experience in power integrity for core power or I/O power.
Strong understanding of how die/package/board decoupling impacts power supply noise across different frequency ranges.
Knowledge of on-die current di/dt control techniques such as dynamic clocking and throttling.
Familiarity with the SIMPLIS tool for regulator modeling; experience in modeling the behavior of on-die di/dt control techniques is highly preferred.
Hands-on experience with PowerSI, 3D modeling tools such as ANSYS HFSS/Q3D, 2.5D tools such as ANSYS SIwave (or similar), and 2D tools such as Ansys 2D
Ways to stand out from the crowd:
Good understanding of how regulators work and expertise in regulator modeling.
Knowledge ofpackage/board/decouplingcapacitor technology & design.
Scripting for analysis automation
You will also be eligible for equity and .
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