Intel Assembly Handling Systems Development Engineer 

Malaysia, Kedah 

906180926

Job Description:

Become a member of the Assembly Test Technology Development in the Media, Inspection, Handling Systems, and Laser (MIHL) Module engineering team.

• Responsible for developing material handling technology involving high accuracy and high-speed pick-n-place systems for next-generation semiconductor packaging technology.
• Responsibilities include development of handling process recipes, design/validation of nozzle tooling, and addressing process/equipment issues on the manufacturing floor while delivering to quality and reliability standards.
• Engage in testing and validating hardware/software upgrades to meet product requirements.
• Respond to customer requests or challenges, develop solutions to problems that meet process, quality, and cost requirements.
• Develop solutions to meet customer requirements from platform specification to validation, deployment, and proliferation to high-volume manufacturing sites.
• Must have a strong background in kinematics and motion control, Design of Experiments (DOE), structured problem solving, and statistics knowledge to plan and conduct experiments to characterize solutions throughout the product life cycle.
• Drive improvements in quality, reliability, cost, yield, process stability, productivity, and safety/ergonomics.

Qualifications:

Minimum Qualifications:

• Possess a Bachelor's or Master's degree in Robotics and Autonomous Systems, Mechanical Engineering, Electrical Engineering or related STEM field.
• Have at least 2 year of work experience. Experience with and fundamental understanding of motion control, high accuracy/speed robotic systems, and vision systems.
• Strong understanding of statistical principles, statistical process control (SPC) and Design of Experiments (DOE).
• Ability to apply fundamental scientific and engineering principles to develop novel design solutions for high volume manufacturing processes.

Preferred Qualifications:

• Fundamental understanding of semiconductor devices and packing technology. Motion control and vision systems background (High speed / high accuracy pick-n-place, 2D vision systems).
• Mechanical design experience (CAD, Solidwork, GD and T) is preferred.
• Data Science and Statistics tools (Python, Numpy/Pandas, SQL, JMP, Minitab)
• Strong influencing, written and verbal communication skills.
• Strong Project/Program management skills.

Experienced HireShift 1 (Malaysia)Malaysia, Kulim

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.