Bachelor’s degree in Electrical Engineering, Computer Engineering, Computer Science, Physics, or a specialized field (e.g., Optics, Sensors, Audio/DSP, etc.), or equivalent practical experience.
3 years of experience in semiconductor and printed circuit board (PCB) fabrication processes.
3 years of experience with electrical test measurements.
3 years of experience organizing and analyzing dataset.
2 years of experience working in a wiring and packaging environment.
Preferred qualifications:
Master's degree or PhD in Electrical Engineering, Computer Engineering, Physics, or a related field (e.g., Optics, Sensors, Audio/DSP).
Experience with reliability engineering and failure analysis methods.
Experience driving yield improvement efforts, six sigma methods, Statistical Process Control (SPC) and Design of Experiments (DOE).
Experience in working with superconducting materials at cryogenic temperatures.
Knowledge of mechanical, PCB, or silicon fabrication principles and the constraints they impose on physical device design.