Amazon Thermal & Mechanical Engineer Annapurna Labs 

United States, Texas, Austin 

191753006

As a member of the Machine Learning Acceleration team you’ll be responsible for the design and optimization of hardware in our data centers. You’ll provide leadership in the application of new technologies to large scale server deployments in a continuous effort to deliver a world-class customer experience. This is a fast-paced, intellectually challenging position, and you’ll work with thought leaders in multiple technology areas. You’ll have high standards for yourself and everyone you work with, and you’ll be constantly looking for ways to improve your products performance, quality and cost. We’re changing an industry, and we want individuals who are ready for this challenge and want to reach beyond what is possible today.

BS or MS degree in Mechanical/Thermal Engineering
5+ years industry experience in Mechanical and Thermal design of Systems
Experience in thermal and performance measurements and characterization on SoCs, Servers, and Systems
3+ years of experience SoC Thermal modelling and IC package transient thermal response
Experience with Chip package, System Mechanical & Thermal design for air-cooled and liquid-cooled systems
Collaborate effectively with teams spanning multiple sites and develop detailed specifications for product teams to use
Work with ODMs, heatsink vendors, and internal design teams on cross-boundary triaging, debugging, and resolving issues across organization.

Knowledge of SoC thermal/mechanical design methodology, power modeling and thermal analysis techniques
Tool Familiarity: Ansys Icepak, FloTherm, Cadence Celsius, PTC Creo, and Solidworks
Programming experience: Bash script, Shell script, Linux, Python, and Lua. Familiarity with working in Linux environment is an added advantage
Working knowledge on fans, valves, chillers, and CDUs
Knowledge of various types of technologies used for Heatsink solutions, Thermal Interface Materials (TIMs) and liquid cooling technologies
Develop detailed CFD and compact RC models for SoC and Package thermal analysis
Knowledge of hardware and software based thermal / power management control algorithms
Optimize thermal solutions under PPA and system design constraints
Simulate and prototype thermal control strategies
Validate thermal models through power/thermal measurements on Hardware