Intel Assembly Media Collaterals Development Engineer 

Malaysia, Kedah 

688678936

Job Description:

• Develops assembly processes and/or equipment and applies novel concepts for innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies.
• Optimizes and improves the efficiency of manufacturing packages, developing processes to meet quality, reliability, cost, yield, productivity, and manufacturability requirements.
• Develops process and equipment specifications applying principles for design of experiments and data analysis, and documents improvements through white papers.
• Develops and maintains equipment to evaluate silicon and package technologies under simulated field use conditions, such as heat, humidity, temperature cycle, and dynamic forces.
• Ensures manufacturability of physical layout of package design and oversees the cycle of manufactured package processes, procedures, and flows.
• Establishes material specifications for contract assemblers and raw material vendors and interfaces with supplier quality and procurement teams to ensure material quality and vendor performance requirements are met through strict adherence to process specifications and existing product qualification methods.
• Develops new techniques and acceleration methods, tools, and quality screens to ensure the early identification of potential problems with packaging quality and reliability.
• Sets reliability requirements to meet customer needs and influences design, material selection, and process development to meet those needs, based on a fundamental understanding of failure mechanisms.
• Leads efforts towards innovating, problem-solving, developing, and continuously improving equipment and processes using experimental design and statistical methods.
• Provides consultation concerning packaging problems and improvements in the packaging process, and responds to customer/client requests or events as they occur.
• Delivers standardization in product qualification, manufacturing quality systems, and methods and continuously engages with packaging technology development and partner engineering groups on process/technology maturity for products towards key risk areas in meeting product milestones.

Qualifications:

Minimum Qualifications:

• Possess a Bachelor's or Master's degree in Mechanical Engineering/MaterialEngineering/ElectricalEngineering/Physics related field.
• Minimum 2 year+ of experience in fundamental science and engineering concepts in development to create novel solutions, including strong knowledge of Statistical Process Control (SPC) and/or Design of Experiments (DOE) principles.
• Experience in analytics and design tools in packaging industry like - AutoCAD, Solidworks, ,etc)
• Experience working with Engineering drawing and tolerancing analysis, design rules.

Preferred Qualifications :

• Strong mechanical design software experience (SolidWorks, AutoCAD, etc)
• Portfolio of self-completed concept to fabrication project examples Assembly equipment, process, media, and/or collateral experience.
• Technical innovation and deliver results for complex, time critical technical projects.
• Understanding of semiconductor fabrication processes and technology with technical and analytical skills.

Experienced HireShift 1 (Malaysia)Malaysia, Kulim

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.