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Google Packaging Engineer Custom Silicon Operations South Korea, Seoul 298678924
09.06.2025
Minimum qualifications:
- Bachelor's degree in Electrical Engineering, Computer Engineering, Material Engineering, or equivalent practical experience.
- 8 years of experience as a Semiconductor Packaging Engineer.
- Experience with semiconductor advanced packaging technologies, assembly processes, IC packaging materials, reliability standards, and Failure Analysis (FA) techniques.
- Experience with technical leadership.
Preferred qualifications:
- Master's degree or PhD in Electrical Engineering, Computer Engineering, Material Engineering, or a related field.
- Experience with SoC and Power Management Integrated Circuit (PMIC) productization.
- Experience in data analysis using semiconductor production data.
- Understanding of advanced packaging, 2.5D packaging, and 3D packaging technologies.
- Ability to work in a fast-paced, rapidly changing environment.
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