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ืžืฆื™ืืช ืžืฉืจืช ื”ื™ื™ื˜ืง ื‘ื—ื‘ืจื•ืช ื”ื˜ื•ื‘ื•ืช ื‘ื™ื•ืชืจ ืžืขื•ืœื ืœื ื”ื™ื™ืชื” ืงืœื” ื™ื•ืชืจ

ื“ืจื•ืฉื™ื Packaging ื‘-United States, California, San Diego

ืžืžืฉื• ืืช ื”ืคื•ื˜ื ืฆื™ืืœ ืฉืœื›ื ื‘ืชืขืฉื™ื™ืช ื”ื”ื™ื™ื˜ืง ืขื ืืงืกืคื•ื™ื ื˜! ื—ืคืฉื• ื”ื–ื“ืžื ื•ื™ื•ืช ืขื‘ื•ื“ื” ื‘ืชื•ืจ Packaging ื‘United States, California, San Diego ื•ื”ืฆื˜ืจืคื• ืœืขื•ื“ ืืœืคื™ื ืฉื›ื‘ืจ ืžืฆืื• ืขื‘ื•ื“ื” ื‘ื—ื‘ืจื•ืช ื”ืžื•ื‘ื™ืœื•ืช. ื”ืชื—ื™ืœื• ืืช ื”ืžืกืข ืฉืœื›ื ืขื•ื“ ื”ื™ื•ื ื•ืžืฆืื• ืืช ื”ืงืจื™ื™ืจื” ื”ืื™ื“ื™ืืœื™ืช ืขื‘ื•ืจื›ื ื‘ืชื•ืจ Packaging ืขื ืืงืกืคื•ื™ื ื˜.
ื—ื‘ืจื”
ืื•ืคื™ ื”ืžืฉืจื”
ืงื˜ื’ื•ืจื™ื•ืช ืชืคืงื™ื“
ืฉื ืชืคืงื™ื“ (1)
United States
California
San Diego
ื ืžืฆืื• 4 ืžืฉืจื•ืช
16.05.2025
A

Amazon Creative Operations Manager Device Packaging Experience United States, California, San Francisco

Limitless High-tech career opportunities - Expoint

ืฉื™ืชื•ืฃ

ื”ืชื—ื‘ืจ/ื™ ื›ื“ื™ ืœื”ื’ื™ืฉ ืžื•ืขืžื“ื•ืช
ืชื™ืื•ืจ:
DESCRIPTION include:* Develop resource forecasts aligned with product roadmap and program schedules* Prioritize projects to meet deadlines while optimizing team workload distribution* Track and analyze program metrics to guide design...
ืคืจื˜ื™ ื”ืžืฉืจื” ื”ืžืœืื™ื

ืžืฉืจื•ืช ื ื•ืกืคื•ืช ืฉื™ื›ื•ืœื•ืช ืœืขื ื™ื™ืŸย ืื•ืชืš

10.05.2025
A

Amazon Sr IC Packaging Design Engineer Project Kuiper United States, California, San Diego

Limitless High-tech career opportunities - Expoint

ืฉื™ืชื•ืฃ

ื”ืชื—ื‘ืจ/ื™ ื›ื“ื™ ืœื”ื’ื™ืฉ ืžื•ืขืžื“ื•ืช
ืชื™ืื•ืจ:
Drive IC packaging design and manufacturing from NPI to volume production. Drive production yield improvement through regular review of supplier key process parameters. Work with package vendors to define package...
ืคืจื˜ื™ ื”ืžืฉืจื” ื”ืžืœืื™ื
28.04.2025
C

Cisco SiliconOne Mechanical Packaging Engineer United States, California, San Jose

Limitless High-tech career opportunities - Expoint

ืฉื™ืชื•ืฃ

ื”ืชื—ื‘ืจ/ื™ ื›ื“ื™ ืœื”ื’ื™ืฉ ืžื•ืขืžื“ื•ืช
ืชื™ืื•ืจ:
BSEE/CS combined with 4+ years of related experience. 4+ Years post graduate hands on experience with System Verilog / UVM programming. 4+ Years post graduate ASIC Verification processes, methodologies, flows...
ืคืจื˜ื™ ื”ืžืฉืจื” ื”ืžืœืื™ื
08.04.2025
I

Intel PBG Advanced Packaging Competitive Lead United States, California, San Jose

Limitless High-tech career opportunities - Expoint

ืฉื™ืชื•ืฃ

ื”ืชื—ื‘ืจ/ื™ ื›ื“ื™ ืœื”ื’ื™ืฉ ืžื•ืขืžื“ื•ืช
ืชื™ืื•ืจ:
Work with TD partners to ensure the TD roadmap is aligned with competitor offerings and suggest roadmap adjustments. Monitor market trends andadvisepackaging strategy adjustments based on market trends. Partner with...
ืคืจื˜ื™ ื”ืžืฉืจื” ื”ืžืœืื™ื
ืชื›ื ื ื• ืืช ืžื”ืœืš ื”ืงืจื™ื™ืจื” ื”ื‘ื ืฉืœื›ื ื‘ืชืขืฉื™ื™ืช ื”ื”ื™ื™ื˜ืง ืขื ืืงืกืคื•ื™ื ื˜! ื”ืคืœื˜ืคื•ืจืžื” ืฉืœื ื• ืžืฆื™ืขื” ืžื’ื•ื•ืŸ ืจื—ื‘ ืฉืœ ืžืฉืจื•ืช Packaging ื‘ืื–ื•ืจ United States, California, San Diego, ื•ืžืขื ื™ืงื” ืœื›ื ื’ื™ืฉื” ืœื—ื‘ืจื•ืช ื”ื˜ื•ื‘ื•ืช ื‘ื™ื•ืชืจ ื‘ืชื—ื•ื. ื‘ื™ืŸ ืื ืืชื ืžื—ืคืฉื™ื ืืชื’ืจ ื—ื“ืฉ ืื• ืฉื™ื ื•ื™ ื ื•ืฃ, ืืงืกืคื•ื™ื ื˜ ืชืงืœ ืขืœ ืžืฆื™ืืช ื”ืชืืžืช ื”ืขื‘ื•ื“ื” ื”ืžื•ืฉืœืžืช ืขื‘ื•ืจื›ื. ืขื ืžื ื•ืข ื”ื—ื™ืคื•ืฉ ื”ืงืœ ืœืฉื™ืžื•ืฉ ืฉืœื ื•, ืชื•ื›ืœื• ืœืžืฆื•ื ื‘ืžื”ื™ืจื•ืช ื”ื–ื“ืžื ื•ื™ื•ืช ืขื‘ื•ื“ื” ื•ืœื—ื‘ื•ืจ ืœื—ื‘ืจื•ืช ืžื•ื‘ื™ืœื•ืช. ื”ื™ืจืฉืžื• ื”ื™ื•ื ื•ืขืฉื• ืืช ื”ืฆืขื“ ื”ื‘ื ื‘ืงืจื™ื™ืจืช ื”ื”ื™ื™-ื˜ืง ืฉืœื›ื ืขื Expoint.